Rajen Sidhu, BASc 2003

I went on to Arizona State University (ASU) in June 2003 to complete my PhD in Material Science and Engineering, focussing on the thermo-mechanical behaviour of lead-free solders for microelectronic packaging technology. After graduating from ASU in June of 2007, I began working at Intel Corporation as a Senior Packaging Engineer. I am in the metallurgy core competency group, leading research and development for next generation material solutions for Intel microprocessors.
Some career highlights:

During my PhD I was awarded:ASM International Graduate Student Paper Contest, 1st PlaceGolden Key International Honour Society – Engineering-Technology Achievement AwardThe Minerals, Metals and Materials Society’s (TMS) Outstanding Graduate Student Paper AwardTMS Electronic, Magnetic & Photonic Materials Division Graduate Poster Contest, 1st Place

During my professional career:

  • TMS Young Leaders Professional Development Award
  • Playing a pivotal role in defining technology roadmaps and evaluating next generation interconnect solutions to address a variety of electronic packaging challenges for Intel CPU microprocessors has allowed me to generate several valuable Intellectual Property in the form of trade secrets and patents.